一例整机电子装联故障分析
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摘要
随着航空电子产品向小型化和高密度化方向的不断发展,对电子产品整机的装联要求也越来越高。该文通过对一例接收组件电子装联故障的分析,得出了该类装联工艺存在短路隐患的针对性工艺优化。按照优化工艺后焊接的接收组件中的前置放大器管脚质量良好,未出现焊锡二次熔化情况,彻底解决了管脚与壳体短路的故障。
With the development of aviation electronic products toward miniaturization and high density,the re-quirements for assembly and connection of electronic products are getting higher and higher.In this paper,through the analysis of an example of the fault of electronic assembly of receiving components,the corresponding process optimization of this kind of assembly process with short-circuit hidden danger is obtained.According to the optimized process,the quality of the preamplifier pin in the receiving assembly is good,and no solder secondary melting occurs,which completely solves the short circuit fault between the pin and the shell.
With the development of aviation electronic products toward miniaturization and high density,the re-quirements for assembly and connection of electronic products are getting higher and higher.In this paper,through the analysis of an example of the fault of electronic assembly of receiving components,the corresponding process optimization of this kind of assembly process with short-circuit hidden danger is obtained.According to the optimized process,the quality of the preamplifier pin in the receiving assembly is good,and no solder secondary melting occurs,which completely solves the short circuit fault between the pin and the shell.
引文
[1]帅小兵.电子装联技术工艺规范分析[J].电子技术与软件工程,2014,(19):118-118.
[2]飞景明,吴琼,张晓超.宇航电源CQFP封装器件抗力学振动装联工艺研究[J].电子工艺技术,2018,39(2):84-87
[3]泰科电子瑞侃(Tyco Electrics Raychem)RNF-100通用型热缩管手册[Z].
[2]飞景明,吴琼,张晓超.宇航电源CQFP封装器件抗力学振动装联工艺研究[J].电子工艺技术,2018,39(2):84-87
[3]泰科电子瑞侃(Tyco Electrics Raychem)RNF-100通用型热缩管手册[Z].