印制电路板用化学镀金工艺的研究进展
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摘要
化学镀金作为印制电路板表面处理工艺,能够提供可焊性、延展性和抗腐蚀性等良好的镀金层,因而被广泛关注和研究。综述了印刷电路板(PCB)上化学镀金的研究进展,介绍了化学镀金原理和化学镀金液组成,叙述了无氰镀金体系的发展,同时从PCB镍金和镍钯金工艺的角度,分析了镀镍层、镀钯层和镀金层之间的相互影响,并对置换镀金和还原镀金进行了讨论,指出后者在生产效率和镀层质量上具有较大优势,并将逐渐取代置换镀金工艺。
Electroless gold plating,as a surface finishing on PCB,has been extensively focused and studied,because it can provide a gold layer with good solerability,ductility and corrosion resistance. The research progress on electroless gold plating on PCB was reviewed in this paper. The principle of electroless gold plating and the composition of the electroless gold plating bath were introduced. The developments of non-cyanide gold plating were described in detail. Moreover,in the view of electroless nickel plating/immersion gold and electroless nickel/palladium/gold plating on PCB,the influences between Ni-layer,Pd-layer and Au-layer were analyzed. Moreover,the immersion gold plating and reduction gold plating were also discussed. It was pointed out that the later had more advantages on production efficiency and plating quality,and would gradually replace the former.
Electroless gold plating,as a surface finishing on PCB,has been extensively focused and studied,because it can provide a gold layer with good solerability,ductility and corrosion resistance. The research progress on electroless gold plating on PCB was reviewed in this paper. The principle of electroless gold plating and the composition of the electroless gold plating bath were introduced. The developments of non-cyanide gold plating were described in detail. Moreover,in the view of electroless nickel plating/immersion gold and electroless nickel/palladium/gold plating on PCB,the influences between Ni-layer,Pd-layer and Au-layer were analyzed. Moreover,the immersion gold plating and reduction gold plating were also discussed. It was pointed out that the later had more advantages on production efficiency and plating quality,and would gradually replace the former.
引文
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[41]SULLIVAN A M,KOHL P A.The autocatalytic deposition of gold in nonalkaline,gold thiosulfate electroless bath[J].Journal of Electrochemical Society,1995,142(7):2 250-2 255.
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[2]刘仁志.镀金与无氰镀金应用述评[J].电镀与精饰,2013,35(5):23-26.
[3]李家明,徐淑庆,梁铭忠.化学镀工艺在电子工业中的应用现状[J].电镀与精饰,2016,38(1):21-24.
[4]JOTHI S,LIAN J,WEI S.Electroless nickel,alloy,composite and nano coatings-a critical review[J].Journal of Alloys and Compounds,2013,571:183-204.
[5]VIANCO P T.An overview of surface finishes and their role in printed circuit board solderability and solder joint performance[J].Circuit World,1998,25(1):6-24.
[6]OEZKOEK M,RAMOS G,METZGER D,et al.Benefits of pure palladium for ENEP and ENEPIG surface finishes:Electronic System-Integration Technology Conference[C].Berlin:IEEE Xplore,2010.
[7]LIM H P,ALI O,BAKAR T A A,et al.The effects of humidity on tin whisker growth by immersion tin plating and tin solder dipping surface finishes[J].Procedia Manufacturing,2015(2):275-279.
[8]WANG W,CHOUBEY A,AZARIAN M H,et al.An assessment of immersion silver surface finish for lead-free electronics[J].Journal of Electronic Materials,2009,38(6):815-827.
[9]RAMIREZ M,HENNEKEN L,VIRTANEN S.Oxidation kinetics of thin copper films and wetting behaviour of copper and organic solderability preservatives(OSP)with lead-free solder[J].Applied Surface Science,2011,257(15):6 481-6 488.
[10]刘海萍,李宁,毕四富,等.无氰化学镀金技术的发展与展望[J].电镀与环保,2007,27(3):4-7.
[11]林金堵.PCB焊接盘表面涂(镀)覆层简要概括[J].印制电路信息,2016(8):30-34.
[12]PUN K P L,ISLAN M N,CHEUNG C W,et al.Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal adding[J].Journal of Materials Science:Materials Electronics,2017,28:12 617-12 629.
[13]黄剑贞,朱琼霞,叶泽鹏,等.无氰镀金技术的研究进展[J].广东化工,2016,43(10):141.
[14]卢银东,凌宗欣,赵晶晶.无氰化学镀金工艺的研究[J].电镀与环保,2012,32(4):27-28.
[15]高桥昭男,山本弘,中岛澄子,等.非电解镀金液及非电解镀金方法:1460131A[P].2003-12-03.
[16]王尧.Ni-P合金基体上亚硫酸盐体系化学镀金研究[D].哈尔滨:哈尔滨工业大学,2016.
[17]李冰.钯催化亚硫酸体系镀金工艺与性能的研究[D].哈尔滨:哈尔滨工业大学,2016.
[18]李冰,李宁,谢金平,等.亚硫酸体系置换镀金的性能表征及工艺优化[J].电镀与涂饰,2016,35(9):444-448.
[19]肖忠良,丁雨,周英,等.超声波对盐基胶体钯活性及稳定性的影响[J].精细化工中间体,2012,42(2):47-50.
[20]吴道新,刘迎.印刷电路板上化学镀钯工艺研究[J].稀有金属材料与工程,2012,41(4):681-684.
[21]肖忠良,高洁,宋刘斌,等.化学置换镀钯的研究[J].长沙理工大学学报,2015,12(1):97-101.
[22]朱梦,吴道新,肖忠良,等.有机膦酸对镍钯金电路板封孔剂缓蚀性能的影响[J].材料保护,2017,50(1):62-67.
[23]肖忠良,卢意鹏,刘姣,等.一种化学还原镀金液复合配位剂的研究[J].表面技术,2017,46(6):263-269.
[24]唐娇,盛国军,李德良,等.“金-硫氰酸根”配合物的合成及沉金性能研究[J].表面技术,2013,42(2):60-62.
[25]陈易,罗洁,钟迪元,等.印制线路板上硫氰酸亚金钾体系化学镀金[J].电镀与涂饰,2017,36(7):357-360.
[26]吴赣红,李德良,董坤,等.一种无氰化学镀金工艺的研究[J].表面技术,2008,37(3):52-54.
[27]TANG X,WANG J,WANG C,et al.A novel surface activation method for Ni/Au electroless plating of acrylonitrilebutadiene-styrene[J].Surface and Coatings Technology,2011,206(6):1 382-1 388.
[28]MARDILOVICH P P,SHE Y,MA Y H.Defect-free palladium membranes on porous stainless-steel support[J].Aiche Journal,1998,44(2):310-322.
[29]VOROBYOVA T N,POZNYAK S K,RIMSKAYA A A,et al.Electroless gold plating from a hypophosphite-dicyanoaurate bath[J].Sufrace and Coatings Technology,2004,176(3):327-336.
[30]OKINAKA Y.An electrochemical study of electroless golddeposition reaction[J].Journal of Electrochemical Society,1973,120(6):739-744.
[31]IACOVANGELO C D.Autocatalytic electroless gold deposition using hydrazine and dimethylamine borane as reducing agents[J].Journal of Electrochemical Society,1991,138(4):976-982.
[32]BALLANTYNE A D,FORREST G C H,FRISCH G,et al.Electrochemistry and speciation of Au+in a deep eutectic solvent:growth and morphology of malvanic immersion coatings[J].Physical Chemistry Chemical Physics,2015,17:30 540-30 550.
[33]邓银.柠檬酸金钾无氰镀金技术的研究[D].重庆:重庆大学,2011.
[34]唐娇.无氰金配合物的合成及应用研究[D].长沙:中南林业科技大学,2013.
[35]LI B,LI N,LUO G,et al.Acceleration effect of Na2S2O3on the immersion gold plating on Ni-P surface from a sulfite based electrolyte[J].Surface and Coatings Technology,2016,302:202-207.
[36]吴水清.镀金添加剂的研究进展[J].电镀与涂饰,2000,19(5):38-43.
[37]刘海萍,李宁,毕四富.聚乙烯亚胺对置换镀金过程中的镍基体腐蚀的影响[J].稀有金属材料与工程,2009,38(6):1 087-1 090.
[38]WANG Y,LIU H,BI S,et al.Effects of organic additives on the immersion gold depositing from a sulfite-thiosulfate solution in an electroless nickel immersion gold process[J].RSC Advances,2016(6):9 656-9 662.
[39]卢意鹏.印制电路板中钯金的化学镀研究[D].长沙:长沙理工大学,2017.
[40]HONMA H,KAGAYA Y.Gold plating using the disulfiteaurate complex[J].Journal of Electrochemical Society,1993,140(9):135-137.
[41]SULLIVAN A M,KOHL P A.The autocatalytic deposition of gold in nonalkaline,gold thiosulfate electroless bath[J].Journal of Electrochemical Society,1995,142(7):2 250-2 255.
[42]WANG X,ISSAVE N,OSTERYOUNG J G.A novel gold electroplating system:gold(I)-iodide-thiosulfate[J].Journal of Electrochemical Society,1998,145(3):974-981.
[43]SULLIVAN A M,KOHL P A.Electrochemical study of the gold thiosulfate reduction[J].Journal of Electrochemical Society,1997,144(5):1 686-1 690.
[44]KATO M,SATO J,Otani H,et al.Substrate(Ni)-catalyzed electroless gold deposition from a noncyanide bath containing thiosulfate and sulfite[J].Journal of Electrochemical Society,2002,149(3):168-172.
[45]LIU H,MAO A,HE M,et al.Effects of p H on the immersion gold process from a sulfite-thiosulfate solution based on the electroless Ni-P alloy susbtrate[J].International Journal of Electrochemical Science,2015(10):7 811-7 817.
[46]HUANG M,LI X,XIA J,et al.A conceivably stable noncyanide electroless gold plating for electronic packaging application:International conference on electronic packaging technology[C].Harbin:IEEE Xplore,2017.
[47]MONLEVADE E F D,PENG W.Failure mechanisms and crack propagation paths in thermally aged Pb-free solder interconnects[J].Journal of Electronic Materials,2007,36(7):783-797.
[48]加藤友人,渡边秀人.还原型化学镀金液及使用该镀金液的化学镀金方法:105745355A[P].2016-07-06.
[49]杨防祖,金磊,刘诚,等.基于杂环类生物碱配位的三价金无氰镀金电镀液及其应用:108754553A[P].2018-11-06.
[50]CHAILLOT A,VENET N,TEGEHALL P E,et al.ENEPIGfinish:an alternative solution for space printed circuit boards(PCB):Microelectronics Packaging conference[C].Grenoble:IEEE Xplore,2014.
[51]张新美.高磷酸性化学镀Ni-P合金的工艺研究[D].济南:山东大学,2006.
[52]缪文桦.光亮剂对化学镀镍镀层的性能影响[D].镇江:江苏科技大学,2005.
[53]KWOK R W M,CHAN K C M,BAYES M W.Development of an electroless nickel immersion gold process for PCB final finishes[J].Circuit World,2004,30(3):37-42.
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