超声波辅助钎焊镁铝异种金属接头的微观组织
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摘要
选用Sn基和Zn基2种钎料,在大气下采用超声波辅助钎焊技术进行了6063铝合金/AZ31B镁合金的焊接,通过OM、SEM以及EDS能谱对比分析了2种钎料的钎焊接头组织。结果表明,采用Sn基钎料时,钎焊接头不会生成Mg-Al脆性金属间化合物,钎缝中会溶解Al元素,Al元素以Al基固溶体相和Ag(Al)相形式存在于钎焊接头中,并且在超声波作用时间达到4.5s时,Al元素均匀分布在整个钎缝中。采用Zn基钎料,钎焊接头中有大量脆性Mg/Al金属间化合物生成,同时在钎缝组织晶界处有第二相低熔点Sn颗粒的弥散分布。
Sn-based and Zn-based soldering filling metals were selected, and 6063 Al alloy and AZ31 B Mg alloy were welded by ultrasonic-assisted soldering in the atmosphere, and the microstructures of the solder joints soldered with the two soldering filler metals were analyzed by OM, SEM and EDS spectrum. The results indicate that when the Sn-based soldering filler metal is adopted, the joints cannot generate Mg-Al brittle intermetallic compounds, and the Al element dissolved in soldering seams exists in the joint in the form of Al-Sn-Zn and Ag(Al) phases, and when the ultrasonic action time reaches 4.5 s, the Al element is uniformly distributed in the whole soldering seam. When the Zn-based soldering filler metal is adopted, a large amount of brittle Mg/Al intermetallic compounds are generated in the joint, and the second phase of Sn particles with low-melting-point disperses at the grain boundary of the soldering seam.
Sn-based and Zn-based soldering filling metals were selected, and 6063 Al alloy and AZ31 B Mg alloy were welded by ultrasonic-assisted soldering in the atmosphere, and the microstructures of the solder joints soldered with the two soldering filler metals were analyzed by OM, SEM and EDS spectrum. The results indicate that when the Sn-based soldering filler metal is adopted, the joints cannot generate Mg-Al brittle intermetallic compounds, and the Al element dissolved in soldering seams exists in the joint in the form of Al-Sn-Zn and Ag(Al) phases, and when the ultrasonic action time reaches 4.5 s, the Al element is uniformly distributed in the whole soldering seam. When the Zn-based soldering filler metal is adopted, a large amount of brittle Mg/Al intermetallic compounds are generated in the joint, and the second phase of Sn particles with low-melting-point disperses at the grain boundary of the soldering seam.
引文
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[2]Li Yajiang(李亚江),Wang Juan(王娟),Liu Peng(刘鹏).Welding and Application of Dissimilar Difficult-Weldable Materials(异种难焊材料的焊接及应用)[M].Beijing:Chemical Industry Press,2004:210
[3]Zhang Jin(张津),Zhang Zonghe(章宗和).Magnesium Alloy and Application(镁合金及应用)[M].Beijing:Chemical Industry Press,2004:179
[4]Dai Xiangyu,Zhang Hongtao,Zhang Hongchang et al.Materials Letters[J],2016,178:235
[5]Wei Qiang(魏强),Chen Yiping(陈益平),Hu Dean(胡德安)et al.Hot Working Technology(热加工工艺)[J],2012,5:148
[6]Shang Jing,Wang Kehong,Zhou Qi et al.Rare Metal Materials and Engineering[J],2013,42(7):1337
[7]Zhou Dianwu(周惦武),Tian Wei(田伟),Xu Shaohua(徐少华)et al.Rare Metal Materials and Engineering(稀有金属材料与工程)[J],2015,44(10):2440
[8]Li Yuanxing,Leng Xuesong,Cheng Sheng et al.Materials and Design[J],2012,40:429
[9]Yu Weiyuan,Liu Senhui,Liu Xinya et al.Journal of Materials Processing Technology[J],2015,221:285
[10]Xu Huibin,Sun Huibin,Chen Hongyou.Rare Metals[J],2013,32(5):469
[11]Wang Heng(王恒),Liu Liming(刘黎明),Liu Xujing(柳绪静).Transactions of the China Welding Institution(焊接学报)[J],2005,7:5
[12]Liu Peng,Li Yajiang,Geng Haoran et al.Materials Letters[J],2007,61(6):1288