埋入式BGA焊点可靠性和信号完整性优化
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摘要
建立了埋入式微尺度球栅阵列(ball grid array, BGA)焊点有限元分析模型和三维电磁仿真模型,分别进行热循环加载分析和信号完整性分析.选取焊点最大径向尺寸、焊点高度和焊盘直径作为设计变量,以焊点的热疲劳寿命和回波损耗最小为目标,利用正交试验和灰色关联分析相结合的方法对BGA焊点进行多目标优化设计,并通过试验对信号完整性优化结果进行了验证.结果表明,优化后焊点最大等效应力下降了8.2%,在热疲劳寿命提高了2.15倍的同时回波损耗降低了11.8%,信号完整性试验验证了优化结果的有效性.
A finite element analysis model of ball grid array(BGA) solder joints and a three-dimensional electromagnetic simulation model were established,respectively. The radial dimension, the height and the pad diameter of the solder joint were selected as design variables.The thermal fatigue life and the return loss of the solder joint were selected as the target. The multi-objective optimization design of BGA solder joints was carried out by the combinationof experiments and grey correlation analysis. The signal integrity optimization results were verified by experiment. The results show that: after optimization the maximum equivalent stress of solder joints was decreased by 8.2%. The return loss decreased by 11.8% and fatigue life increased 2.15 times. The signal integrity experiment verified the effectiveness of the optimization results.
A finite element analysis model of ball grid array(BGA) solder joints and a three-dimensional electromagnetic simulation model were established,respectively. The radial dimension, the height and the pad diameter of the solder joint were selected as design variables.The thermal fatigue life and the return loss of the solder joint were selected as the target. The multi-objective optimization design of BGA solder joints was carried out by the combinationof experiments and grey correlation analysis. The signal integrity optimization results were verified by experiment. The results show that: after optimization the maximum equivalent stress of solder joints was decreased by 8.2%. The return loss decreased by 11.8% and fatigue life increased 2.15 times. The signal integrity experiment verified the effectiveness of the optimization results.
引文
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[2]Ge Y,Cook J,Pei M,et al.Solder joint height impact on temperature cycle reliability of BGA components with thermal enabling load[C]//Institute of Electrical and Electronics Engineers(IEEE)2014:684-689.
[3]Njoku J E,Mallik S,Bhatti R,et al.Effect of component standoff height onthermo-mechanical reliability of ball grid array solder joints operating in high temperature ambient[C]//Institute of Electrical and Electronics Engineers(IEEE),2015:231-236.
[4]黄春跃,郭广阔,梁颖,等.基于HFSS的高速互连BGA焊点信号完整性分析[J].系统仿真学报,2014,26(12):2985-2990.Huang Chunyue,Guo Guangkuo,Liang Ying,et al.Anlysis of singnal intergrity of the high-speed interconnects BGA solder based on HFSS[J].Journal of System Simulation,2014,26(12):2985-2990.
[5]石光耀,尚玉玲,曲理.BGA焊点形态和布局对信号完整性的影响[J].桂林电子科技大学学报,2013,33(4):279-283.Shi Guangyao,Shang Yuling,Qu Li.Influence of BGA solder joints on signal integrity[J].Joural of Guilin University of Electronic Technology,2013,33(4):279-283.
[6]韦何耕,黄春跃,梁颖,等.热循环加载条件下PBGA叠层无铅焊点可靠性分析[J].焊接学报,2013,34(10):91-94.Wei Hegeng,Huang Chunyue,Liang Ying,et al.Reliability analysis of plastic ball grid array double-bump lead-free solder joint under thermal cycle[J].Transactions of the China Welding Institution,2013,34(10):91-94.
[7]陈向阳.SMT焊点三维形态预测模型到可靠性分析模型的转换[D].桂林:桂林电子科技大学,2005.
[8]杨德.试验设计与分析[M].北京:中国农业出版社,2002.
[9]熊国际,黄春跃,梁颖,等.基于正交设计和灰色关联的硅通孔互连结构随机振动优化设计[J].焊接学报,2016,37(7):22-26.Xiong Guoji,Huang Chunyue,Liang Ying,et al.Optimization design for TSV interconnect structure based on orthogonal experimental and grey relational analysis under random vibration load[J].Transactions of the China Welding Institution,2016,37(7):22-26.
[10]胡成亮,刘全坤,王强,等.基于灰色关联和模糊逻辑的齿轮锻模多目标优化设计[J].中国机械工程,2007(14):1739-1742.Hu Chengliang,Liu Quankun,Wang Qiang,et al.Multi-objective optimal design of the gear forging die based on grey relationnal and fuzzy logic[J].China Mechanical Engineering,2007(14):1739-1742.