Mg-Cu合金热物性的分子动力学计算
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  • 英文篇名:Molecular dynamics simulation of thermodynamic properties of Mg-Cu alloys
  • 作者:余嘉鹏 ; 程晓敏 ; 李元元 ; 李蓓 ; 徐虹
  • 英文作者:YU Jiapeng;CHENG Xiaomin;LI Yuanyuan;LI Bei;XU Hong;School of Materials Science and Engineering, Wuhan University of Technology;School of Electromechanical and Automobile Engineering, Huanggang Normal University;Laboratory LCP-A2MC, University of Lorraine;
  • 关键词:二元合金 ; 金属相变 ; 热物性 ; 分子动力学
  • 英文关键词:binary alloy;;metal phase transition;;thermodynamic property;;molecular dynamics
  • 中文刊名:CNKX
  • 英文刊名:Energy Storage Science and Technology
  • 机构:武汉理工大学材料科学与工程学院;黄冈师范学院机电与汽车工程学院;洛林大学LCP-A2MC实验室;
  • 出版日期:2019-06-28 09:18
  • 出版单位:储能科学与技术
  • 年:2019
  • 期:v.8;No.42
  • 语种:中文;
  • 页:CNKX201904024
  • 页数:6
  • CN:04
  • ISSN:10-1076/TK
  • 分类号:159-164
摘要
采用原子嵌入势对Mg-Cu合金块体进行了分子动力学模拟。研究了不同含量的Cu元素对Mg-Cu合金的热物性和微观结构的影响。基于能量-温度曲线与比热容-温度曲线对熔化温度以及熔化焓进行了研究,结果表明,随着Cu含量的增加,Mg-Cu合金的熔点先减小后增加,其熔化焓先增加后减小;所有合金的密度和比热容均随Cu含量的增加而降低,热导率随Cu含量的增加而增加。表征了Mg-Cu合金在常温下的微观结构,结果表明,Mg-Cu合金中不同原子之间的相互作用更强,有利于α+Mg_2Cu共晶组织的形成,其模拟结果证实了共晶体是影响合金熔化焓以及热导率的一个主要因素。
        The Mg-Cu alloys were studied using the molecular dynamics approach with an embedded atom method(EAM). The thermal properties and microstructure of different Mg-Cu alloys were investigated. The melting temperature and enthalpy were studied based on the energy-temperature curve and the C_p-temperature curve. The results showed that, with the growth of Cu content, the melting point of Mg-Cu alloys decreased first and then increased, and the melting enthalpy increased first and then decreased. With the increase of Cu content, the density and specific heat capacity decreased, and the thermal conductivity increased. We simulated the microstructure of Mg-Cu alloy at the room temperature. The results showed that the interaction between different atoms in Mg-Cu alloy was stronger, which was beneficial to the formation of α+Mg_2Cu eutectic structure. The simulation results also confirmed that the α+Mg_2Cu eutectic was a major factor affecting the melting enthalpy and thermal conductivity of the Mg-Cu alloy.
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